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       MBR5H100MFS, NRVB5H100MFS http://onsemi.com 4 TYPICAL CHARACTERISTICS Figure 7. Forward Current Derating Over Case Temperature Figure 8. Forward Current Derating Over Ambient Temperature TC, CASE TEMPERATURE (°C) TA, AMBIENT TEMPERATURE (°C) 175 170 165 160 155 150 0 1 2 4 5 6 8 9 60 160 180 140 120 100 80 40 20 0 0 1 2 3 4 5 6 Figure 9. Maximum Forward Power Dissipation Figure 10. Steady State Junction to Ambient Thermal Resistance IF, AVERAGE RECTIFIED FORWARD CURRENT (A) COPPER HEAT SPREADER AREA (mm2) 5 4 3 2 1 0 0 1 2 3 500 700600 400 300 200 100 0 0 20 40 60 80 100 120 140 Figure 11. Transient Thermal Response, Junction to Case PULSE TIME (sec) 0.01 0.001 0.0001 0.000001 0.00001 0.01 0.1 1 10 I F , AVERAGE RECTIFIED FORWARD CURRENT (A) I F , AVERAGE RECTIFIED FORWARD CURRENT (A) P D , AVERAGE FORWARD POWER DISSIPATION (W) JA ( ° C/W) R(t) ( ° C/W) 3 7 RJC = 1 °C/W DC Square Wave RJA = 49 °C/W Square Wave DC TJ = 175 °C Square Wave DC 1 oz. Copper PCB 2 oz. Copper PCB Assumes 25°C Ambient Temperature Assumes 25°C ambient and soldered to a 600 mm2 ? 1 oz copper pad on PCB 0.1 1 10 100 1000 50% Duty Cycle Single Pulse 20% 10% 5% 2% 1% |